Crerax expandable and multifunctional microspheres—critical innovations and solutions—empower high-end manufacturing in semiconductors and electronics by enabling cutting-edge material properties. This technological advancement drives breakthrough innovations and develops new quality productive forces.
Applications
Heat-Release Tapes
In heat-release tapes, Crerax expandable microspheres primarily serve a debonding function. When heated, the microspheres expand, significantly reducing the adhesion of the adhesive layer and thus enabling quick and clean release from the substrate.
Polishing Pads
In wafer polishing pads, Crerax expandable microspheres help reduce polishing defects while improving planarization efficiency and increasing pad removal rates—enhancing overall semiconductor manufacturing precision.
Light-Diffusion Films
Crerax light-diffusing microspheres are used in specialized optical films for LCD, OLED, and photovoltaic (PV) applications to ensure uniform light distribution across display areas. They enhance haze and transparency, deliver superior optical performance, and contribute to energy efficiency and sustainability.
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